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Thermal Equivalent Circuit Diagrams for Junction Temperature Calculations

              The calculation of junction temperatures is based on simplified thermal equivalent circuit diagrams (Figure 1)  in which three dimensional structures are mapped to one dimensional models....

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Thermal Modeling of Power Module Cooling Systems

              The extensive heat build-up in power modules caused by forward, switching, and blocking losses has to be dissipated by means of heatsinks. These heatsinks provide an expanded surface for...

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Power Module Junction Temperature Calculation

  Examples of power module junction temperature calculations for various operating conditions are given below. The following calculations make use of thermal equivalent circuit diagrams, a method that...

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Failure Mechanisms During Power Cycling

  The thermo-mechanical stress between materials with different thermal expansion coefficients (CTE) leads to aging of connections when they are exposed to temperature changes. Which of the mechanisms...

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Thermal stacking of Power Modules

              When thermally stacking several heatsinks, in particular in combination with larger power electronics assemblies, the reduction in coolant flow rate resulting from the increased pressure...

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Forced Air Cooling of Power Modules

              In contrast to natural air cooling, forced air cooling can reduce the thermal heatsink resistance to 1/5...1/15. Figure 1 compares the Zth(s-a) characteristics of natural and forced air...

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Water Cooling of Power Modules

              Water cooling in power modules can be used for very high power inverters (MW range) as well as for low-power devices which already have a water cycle for operating reasons (e.g. car...

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Evaluation of Temperature Curves Regarding Power Module Lifetime

              All internal connections of power modules are subject to aging caused by temperature fluctuations. The fatigue of material as well as wear and tear is caused by thermal stress due to the...

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Thermal Paste Application

              Designated use of thermal interface material (TIM) When in operation, power modules produce losses which increase the module temperature and impair module efficiency and/or functionality....

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Modeling of Temperature Dependence of Power Semiconductor I-V Curves

              The I-V curve is the most important parameter of power semiconductors (PSD), since power semiconductor output capacity and efficiency depends upon it to a great extent. Many publications...

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