Thermal Equivalent Circuit Diagrams for Junction Temperature Calculations
The calculation of junction temperatures is based on simplified thermal equivalent circuit diagrams (Figure 1) in which three dimensional structures are mapped to one dimensional models....
View ArticleThermal Modeling of Power Module Cooling Systems
The extensive heat build-up in power modules caused by forward, switching, and blocking losses has to be dissipated by means of heatsinks. These heatsinks provide an expanded surface for...
View ArticlePower Module Junction Temperature Calculation
Examples of power module junction temperature calculations for various operating conditions are given below. The following calculations make use of thermal equivalent circuit diagrams, a method that...
View ArticleFailure Mechanisms During Power Cycling
The thermo-mechanical stress between materials with different thermal expansion coefficients (CTE) leads to aging of connections when they are exposed to temperature changes. Which of the mechanisms...
View ArticleThermal stacking of Power Modules
When thermally stacking several heatsinks, in particular in combination with larger power electronics assemblies, the reduction in coolant flow rate resulting from the increased pressure...
View ArticleForced Air Cooling of Power Modules
In contrast to natural air cooling, forced air cooling can reduce the thermal heatsink resistance to 1/5...1/15. Figure 1 compares the Zth(s-a) characteristics of natural and forced air...
View ArticleWater Cooling of Power Modules
Water cooling in power modules can be used for very high power inverters (MW range) as well as for low-power devices which already have a water cycle for operating reasons (e.g. car...
View ArticleEvaluation of Temperature Curves Regarding Power Module Lifetime
All internal connections of power modules are subject to aging caused by temperature fluctuations. The fatigue of material as well as wear and tear is caused by thermal stress due to the...
View ArticleThermal Paste Application
Designated use of thermal interface material (TIM) When in operation, power modules produce losses which increase the module temperature and impair module efficiency and/or functionality....
View ArticleModeling of Temperature Dependence of Power Semiconductor I-V Curves
The I-V curve is the most important parameter of power semiconductors (PSD), since power semiconductor output capacity and efficiency depends upon it to a great extent. Many publications...
View Article
More Pages to Explore .....